by minicircuitsadmin | May 26, 2015 | Surface Mount Assembly & Manufacturing Techniques
Purpose: The purpose of this article is to describe a method for heat sinking of Mini‐Circuits high‐power surface mount components to prevent overheating when operating at high power. Scope: This article applies to all Mini-Circuits surface mount components in case...
by minicircuitsadmin | May 6, 2015 | Surface Mount Assembly & Manufacturing Techniques
1. Introduction: The following article is a guide for handling moisture sensitive surface mount devices and is based on the IPC/JEDEC industry standard J-STD-033 available from JEDEC. Non-hermitically sealed electronic components absorb moisture from the environment....
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