by minicircuitsadmin | Mar 31, 2017 | Engineering Resources, Surface Mount Assembly & Manufacturing Techniques
Figure 1: Examples of components soldered to circuit boards. What automated soldering methods can be considered for Mini-Circuits surface-mount components? There are two basic methods: reflow and wave soldering. Generally, reflow soldering can be done when (1) there...
by minicircuitsadmin | May 28, 2015 | Surface Mount Assembly & Manufacturing Techniques
1. Introduction Mini-Circuits has a long history of manufacturing high quality surface mount components in a variety of: Shapes and sizesMonolithic and hybridLeaded and leadlessOpen structure and encapsulatedRoHS compliant or SnPb (tin/lead)Aqueous washable, hermetic,...
by minicircuitsadmin | May 26, 2015 | Surface Mount Assembly & Manufacturing Techniques
1. Introduction: The following article is a guide for soldering wire connections to turret pin terminals on the Mini-Circuits ZX series amplifier, power detector, voltage variable attenuator, digital step attenuator, RF switch, bias-tee, and VCO models. The...
by minicircuitsadmin | Apr 11, 2015 | Amplifiers, Engineering Resources
Introduction Mini-Circuits MNA amplifiers are manufactured in a 3 x 3 mm (.118 x .118-inch) plastic molded package, case style DQ849. This surface mount package is designed for installation on a user’s PC board via a process that typically includes the following...
